BGA and Surface Mount Heatsinks
Thermal Solutions International, Inc. also specializes in low power surface mount and BGA (Ball Grid Array) Heatsinks.
BGA AND SURFACE MOUNT HEATSINKS
TSI offers a wide range of board level heat sinks for IC (Integrated Circuit) packages such as BGA and DIP packages and discrete power semiconductor packages. We carry heatsinks for the following JEDEC outlines:
TO-202
TO-218
TO-220
TO-247
TO-262
TO-263

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Office
12076 Palmer Drive
Moorpark, CA 93021
USA
Hours
Monday – Friday
8:00 a.m. to 5:00 p.m. pst
Call Us
(805) 277-9118

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